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Application of power amplifier in ultrasonic elliptic centerless grinding technology

Author:Aigtek Number:0 Date:2024-08-06

Name of experimentapplication of power amplifier in ultrasonic elliptic vibration centerless grinding test

Research directionultrasonic elliptic vibration

Purpose of experimentby comparing the grinding quality of ultrasonic elliptic centerless grinding and ordinary centerless grinding, combine with the removal mechanism of YAG single crystal grinding, analyze the effect of ultrasonic elliptic vibration on material removal.

Test equipmentelliptical vibration transducer, signal generator, ATA-2042 power amplifier, etc.

Experimental process

Based on the existing laboratory conditions, the experimental platform was built on the precision surface grinding machine. In order to adapt to the grinding of various workpieces with different diameters, an inclined plane sliding table with a groove is placed below the supporting plate. The sliding table can be lifted in a range of 10mm. The supporting plate is fixed on the plane of the inclined plane sliding groove by bolts, and the overall device is shown in the figure. The sliding table can move freely on the grinding machine working surface. The inclined sliding table and ultrasonic elliptical vibration device are fixed by electromagnetic suction cups. The ultrasonic elliptical vibration device is driven by the signal generator and the power amplifier after amplifying the voltage. When the ultrasonic driving device works, the workpiece can rotate along the axis at the vibration binding part.

ultrasonic elliptic centerless grinding device 

ultrasonic elliptic centerless grinding device

ultrasonic elliptic centerless grinding experimental platform 

ultrasonic elliptic centerless grinding experimental platform

Result of experiment:

As shown in the figure, the workpiece was obtained by ordinary centerless grinding with a diameter of 1mm. The grinding wheel used in the processing was cast iron foundation stone grinding wheel with a grain size of W20. A set of grinding tests without ultrasonic elliptic vibration was set up for comparison during the orthogonal test. The roughness of a) ordinary centerless grinding, b) non-ultrasonic elliptic grinding and c) ultrasonic elliptic centerless grinding were compared.

英文0806-1-3

英文0806-1-4

英文0806-1-5 

Conclusion of experiment

The effects of ultrasonic elliptic vibration on the grinding process were verified by comparing the grinding quality of ordinary centerless grinding with that without ultrasonic elliptic vibration. Finally, YAG single crystal micro-cylinder with surface roughness of Ra0.56um and diameter of 0.7mm was obtained. By combining the material removal mechanism with the ultrasonic elliptic vibration theory, the normal force exerted by a single abrasive particle on the workpiece during grinding was established, and the reduction effect of ultrasonic elliptic centerless grinding on the normal force was analyzed theoretically.

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