Application Cases

With the continuous advancement of MEMS (Micro-Electro-Mechanical Systems) technology, it is now widely applied across multiple fields, including biology, aviation, medicine, and aerospace. MEMS sensors, also known as micro-electro-mechanical systems, are an engineering technology that integrates precision mechanical systems with microelectronic circuit technology. Their dimensions typically operate at the micrometer scale.

Figure: Schematic Diagram of MEMS Micro-Electro-Mechanical Systems

The success of MEMS sensors largely depends on packaging technologies, including SIP (System-in-Package), WLP (Wafer-Level Packaging), 3D Through-Silicon Via (TSV), and others. By employing 3D stacking techniques, miniaturized sensor mechanical components and other microelectronic modules can be integrated. The choice of packaging format depends on specific application requirements.

For most MEMS sensors to function properly and deliver desired performance, internal movable microstructures must undergo deformation and displacement within an appropriate range. Therefore, modal testing of MEMS requires inducing vibrations, which necessitates external excitation.

Excitation methods for MEMS modal testing include magnetic excitation, thermal excitation, electrostatic excitation, piezoelectric excitation, acoustic excitation, and base excitation using piezoelectric ceramics.

For the various excitation methods applied to MEMS, selecting the appropriate excitation device is crucial. The Antai ultrasonic power amplifier offers a maximum output voltage of 10 kV, a maximum output current of 64 Ap, a maximum output power of 10 kW, and digitally adjustable voltage gain, making it capable of meeting diverse excitation requirements.

Working Principle of Ultrasonic Power Amplifiers in MEMS Ultrasonic Testing:

High-frequency MEMS core components primarily involve piezoelectric control devices, which utilize the piezoelectric and inverse piezoelectric effects to convert mechanical energy into electrical energy and vice versa. Under excitation by high-frequency electrical signals, piezoelectric control devices generate high-frequency vibrations, thereby producing ultrasonic waves. These ultrasonic waves are then received by piezoelectric control devices and converted back into electrical signals, enabling the transformation of ultrasonic signals.

High-frequency MEMS devices are typically driven by oscillatory excitation, using square waves or pulse oscillators. Since high-frequency MEMS requires currents above 1 MHz and voltages of 30 Vp-p, and signal generators generally offer lower output voltages and limited load capacity, ultrasonic power amplifiers are essential for experimental testing.

Antai Recommendation: ATA-2041 High-Voltage Amplifier

Figure: Specifications of the ATA-2041 High-Voltage Amplifier